Ceramic Wafer Racks

Huffman machining systems are capable of the production grinding of ceramic wafer racks for the electronics/computer industry. These racks are used for wafer manufacturing. Precision is of the utmost importance, and Huffman machining systems grind stringent slot spacing for uniform heat transfer and distribution during the wafer baking process.

Process

• The contact probe determines the part/fixture location.
• The grinding wheel width determines the slot width.
• A single wheel setup is used.
• An in-process wheel measurement system is used to monitor and compensate for wheel wear.

Material

• Ceramic

Cycle Times

• Actual cycle times will depend upon part configuration.

Features and Benefits

• Available on the Huffman HS-150 and HS-200 series grinding machines.
• High-resolution scale feedback is used on the linear axes.
• A contact probe is used for determining part location.
• Wheel truing system with variable speed control is available.
• Off-line workstation for program storage is available.
• Coolant spray washdown for clearing the machine enclosure of grinding swarf is available.
• Custom fixturing (depending upon part configuration) may be required.